R&D engineer at ASM
Hai Yang is a(n) R&D engineer working at ASM.
Get Hai Yang's email for freeName | Position | Contacts | ||
---|---|---|---|---|
FO | Felipe O. | Sr. Product Marketing EngineerASM | @asm.com+31 8 | Get contact |
MG | Marc Gordien | Vice President ConsultingASM | @asm.com+31 8 | Get contact |
BR | Bob Rowinsky | food demonstraterASM | @asm.com+31 8 | Get contact |
AE | Ahmed Eladawy | asmASM | @asm.com+31 8 | Get contact |
PC | Pilar Crespo | Coordinadora FormaciónASM | @asm.com+31 8 | Get contact |
MM | Maheshkumar Madhesh | techASM | @asm.com+31 8 | Get contact |
HS | Hacer Sevinc | hacerASM | @asm.com+31 8 | Get contact |
TS | Todd Schimke | Sr. StaffASM | @asm.com+31 8 | Get contact |
MG | Melchor Gracias | conductorASM | @asm.com+31 8 | Get contact |
BR | Bruce Ragsdale | Corporate Vice President Global OperationsASM | @asm.com+31 8 | Get contact |
Name | Position | Contacts | ||
---|---|---|---|---|
PM | Patrick Maitre | R&D Engineer, Silicon photonicsSTMicroelectronics | @st.com+41 2 | Get contact |
LI | Lisa Irimata | Packing R&D EngineerIntel Corporation | @intel.com(408) | Get contact |
SS | Shaariq Shaikh | Test R&D EngineerIntel Corporation | @intel.com(408) | Get contact |
NR | Nick Ross | Sr. Packaging R&D EngineerIntel Corporation | @intel.com(408) | Get contact |
YL | Yingzhuo Liu | R&D engineerASM | @asm.com+31 8 | Get contact |
NB | Nitesh Barwade | R&D Engineer IC Design llLSI, an Avago Technologies Company | @lsi.com(408) | Get contact |
SD | Sean Devlin | IC Packaging R&D EngineerIntel Corporation | @intel.com(408) | Get contact |
YG | Yang Guo | Packaging R&D EngineerIntel Corporation | @intel.com(408) | Get contact |
ST | Sridutt Tummalapalli | Test R&D EngineerIntel Corporation | @intel.com(408) | Get contact |
AP | Anna Prakash | R & D Engineer (Semiconductor Packaging Materials)Intel Corporation | @intel.com(408) | Get contact |